以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
// Nothing stops you from doing this，详情可参考safew官方下载
，推荐阅读Line官方版本下载获取更多信息
For implementers, the locking model adds a fair amount of non-trivial internal bookkeeping. Every operation must check lock state, readers must be tracked, and the interplay between locks, cancellation, and error states creates a matrix of edge cases that must all be handled correctly.，更多细节参见同城约会
AI在野蛮生长，电网在原地踏步。矛盾最终指向一个结果：算力的成本，正在由全民买单。